成都smt焊接加工_小批(pi)量(liang)電路板加工_電子焊接

SMT貼(tie)片加工的(de)(de)次要(yao)目(mu)的(de)(de)是將(jiang)貼(tie)片元(yuan)器件貼(tie)裝到(dao)PCB的(de)(de)焊(han)盤(pan)(pan)上，有的(de)(de)公司將(jiang)一(yi)(yi)個(ge)(ge)(ge)焊(han)盤(pan)(pan)計(ji)算爲(wei)一(yi)(yi)個(ge)(ge)(ge)點，但(dan)也有將(jiang)兩個(ge)(ge)(ge)焊(han)算計(ji)作一(yi)(yi)個(ge)(ge)(ge)點的(de)(de)情況。本文以(yi)焊(han)盤(pan)(pan)計(ji)算爲(wei)一(yi)(yi)個(ge)(ge)(ge)點爲(wei)例。只需求計(ji)算PCB板上一(yi)(yi)切的(de)(de)焊(han)盤(pan)(pan)數即可，但(dan)是遇(yu)到(dao)一(yi)(yi)些特殊(shu)的(de)(de)元(yuan)器件，比如(ru)電(dian)感、大(da)的(de)(de)電(dian)容、IC等

（）A:7.0*7.0*4.5mmB:7.0*7.0*4.0mmC:7.0*7.0*4.8mmD:7.0*7.0*5.0mm12.匯眾森所生產的(de)電(dian)(dian)(dian)感(gan)(gan)主要(yao)應(ying)用于(yu)哪(na)些方(fang)面？（）A:筆記本電(dian)(dian)(dian)腦、錄像(xiang)機、機頂盒B:液晶顯示(shi)器、通(tong)訊設備(bei)C:開關電(dian)(dian)(dian)源(yuan)、安防設備(bei)D:、航空電(dian)(dian)(dian)阻的(de)基(ji)本單(dan)(dan)位是什(shen)么(me)？（）A:歐姆B:伏特C:安培D:亨下面屬(shu)于(yu)被動元器件的(de)有(you)哪(na)些？（）A:電(dian)(dian)(dian)阻B:半導體C:電(dian)(dian)(dian)容(rong)D:電(dian)(dian)(dian)感(gan)(gan)匯眾森生產的(de)電(dian)(dian)(dian)感(gan)(gan)的(de)繞線方(fang)式(shi)正(zheng)確的(de)一(yi)項？（）A:單(dan)(dan)層(ceng)平繞式(shi)B:多層(ceng)亂繞式(shi)C:蜂房式(shi)繞線D:多層(ceng)平繞式(shi)電(dian)(dian)(dian)感(gan)(gan)在電(dian)(dian)(dian)路中的(de)基(ji)本作(zuo)用形象(xiang)的(de)說法是“通(tong)直阻交”下面哪(na)些項正(zheng)確？（）A:濾波B:振蕩(dang)C:延遲D:陷波電(dian)(dian)(dian)感(gan)(gan)量的(de)標稱方(fang)式(shi)有(you)哪(na)些？

同時(shi)(shi)(shi)(shi)也(ye)給出了不正確的(de)(de)圖案(an)。過(guo)(guo)量的(de)(de)焊(han)錫會影(ying)響產(chan)(chan)(chan)品(pin)抵抗機械(xie)(xie)(xie)應(ying)(ying)力(li)(li)的(de)(de)能力(li)(li)，因此在(zai)設(she)計圖案(an)時(shi)(shi)(shi)(shi)應(ying)(ying)引起注(zhu)意。下(xia)面是電(dian)(dian)(dian)(dian)容(rong)器安(an)裝(zhuang)好與壞的(de)(de)例(li)子，選(xuan)擇(ze)貼(tie)裝(zhuang)位置，應(ying)(ying)盡(jin)可能減小(xiao)電(dian)(dian)(dian)(dian)路(lu)(lu)(lu)板(ban)(ban)(ban)在(zai)彎曲時(shi)(shi)(shi)(shi)受(shou)到(dao)的(de)(de)機械(xie)(xie)(xie)應(ying)(ying)力(li)(li)。對(dui)于電(dian)(dian)(dian)(dian)路(lu)(lu)(lu)板(ban)(ban)(ban)分(fen)(fen)撥(bo)的(de)(de)電(dian)(dian)(dian)(dian)容(rong)器，在(zai)分(fen)(fen)撥(bo)時(shi)(shi)(shi)(shi)受(shou)到(dao)的(de)(de)機械(xie)(xie)(xie)應(ying)(ying)力(li)(li)大(da)小(xiao)與電(dian)(dian)(dian)(dian)容(rong)器的(de)(de)安(an)裝(zhuang)有關，在(zai)沿著分(fen)(fen)撥(bo)線分(fen)(fen)撥(bo)電(dian)(dian)(dian)(dian)路(lu)(lu)(lu)板(ban)(ban)(ban)時(shi)(shi)(shi)(shi)，對(dui)產(chan)(chan)(chan)品(pin)施(shi)加的(de)(de)機械(xie)(xie)(xie)應(ying)(ying)力(li)(li)與使用(yong)的(de)(de)方法(fa)關系(xi)很大(da)。分(fen)(fen)析電(dian)(dian)(dian)(dian)路(lu)(lu)(lu)板(ban)(ban)(ban)時(shi)(shi)(shi)(shi)片狀元件(jian)受(shou)到(dao)的(de)(de)作(zuo)用(yong)按如下(xia)順序增(zeng)大(da)：分(fen)(fen)折、剪切(qie)、V型(xing)槽、穿孔。因此，貼(tie)裝(zhuang)時(shi)(shi)(shi)(shi)應(ying)(ying)該(gai)考(kao)慮電(dian)(dian)(dian)(dian)路(lu)(lu)(lu)板(ban)(ban)(ban)的(de)(de)分(fen)(fen)撥(bo)過(guo)(guo)程(cheng)。產(chan)(chan)(chan)品(pin)在(zai)電(dian)(dian)(dian)(dian)路(lu)(lu)(lu)板(ban)(ban)(ban)貼(tie)裝(zhuang)時(shi)(shi)(shi)(shi)，不應(ying)(ying)該(gai)受(shou)到(dao)過(guo)(guo)大(da)的(de)(de)沖擊(ji)。必須定期對(dui)吸(xi)頭(tou)和定位爪(zhua)進行檢查、維修(xiu)和更換。貼(tie)片電(dian)(dian)(dian)(dian)容(rong)的(de)(de)陶(tao)瓷體是一種脆(cui)性(xing)(xing)材料。如果PCB板(ban)(ban)(ban)受(shou)到(dao)彎曲時(shi)(shi)(shi)(shi)，它(ta)會受(shou)到(dao)一定的(de)(de)機械(xie)(xie)(xie)應(ying)(ying)力(li)(li)沖擊(ji)。1.貼(tie)裝(zhuang)完畢的(de)(de)電(dian)(dian)(dian)(dian)路(lu)(lu)(lu)板(ban)(ban)(ban)在(zai)運輸過(guo)(guo)程(cheng)中板(ban)(ban)(ban)與板(ban)(ban)(ban)間隔之間采用(yong)軟性(xing)(xing)防護墊進行防護（海綿、珍珠棉、紙板(ban)(ban)(ban)等）；2.電(dian)(dian)(dian)(dian)路(lu)(lu)(lu)板(ban)(ban)(ban)在(zai)使用(yong)過(guo)(guo)程(cheng)中要做到(dao)輕拿輕放，避免(mian)粗暴作(zuo)業產(chan)(chan)(chan)生碰撞；3.電(dian)(dian)(dian)(dian)路(lu)(lu)(lu)板(ban)(ban)(ban)應(ying)(ying)在(zai)軟性(xing)(xing)防護墊上(shang)放置，不要隨意疊(die)加放置。

通(tong)常(chang)是(shi)(shi)以熱(re)固(gu)化(hua)(hua)(hua)為(wei)主，它用(yong)環(huan)氧樹脂、固(gu)化(hua)(hua)(hua)劑、增韌性、填(tian)料(liao)及(ji)觸變劑混合(he)而成(cheng)。(2)聚(ju)丙烯類(lei)(lei)(lei)貼(tie)(tie)(tie)片(pian)膠(jiao)(jiao)(jiao)。聚(ju)丙烯類(lei)(lei)(lei)貼(tie)(tie)(tie)片(pian)膠(jiao)(jiao)(jiao)是(shi)(shi)SMT中常(chang)用(yong)的(de)另一(yi)大(da)類(lei)(lei)(lei)貼(tie)(tie)(tie)片(pian)膠(jiao)(jiao)(jiao)，它是(shi)(shi)光固(gu)化(hua)(hua)(hua)型(xing)(xing)的(de)貼(tie)(tie)(tie)片(pian)膠(jiao)(jiao)(jiao)，其特點是(shi)(shi)固(gu)化(hua)(hua)(hua)時間短(duan)，怛強度不及(ji)環(huan)氧樹脂型(xing)(xing)貼(tie)(tie)(tie)片(pian)膠(jiao)(jiao)(jiao)高(gao)。它通(tong)常(chang)由聚(ju)丙烯類(lei)(lei)(lei)樹脂、光固(gu)化(hua)(hua)(hua)劑和填(tian)料(liao)組成(cheng)。按(an)功能分按(an)功能分，貼(tie)(tie)(tie)片(pian)膠(jiao)(jiao)(jiao)有結構(gou)型(xing)(xing)貼(tie)(tie)(tie)片(pian)膠(jiao)(jiao)(jiao)、非(fei)結構(gou)型(xing)(xing)貼(tie)(tie)(tie)片(pian)膠(jiao)(jiao)(jiao)和密封(feng)(feng)型(xing)(xing)貼(tie)(tie)(tie)片(pian)膠(jiao)(jiao)(jiao)。結構(gou)型(xing)(xing)貼(tie)(tie)(tie)片(pian)膠(jiao)(jiao)(jiao)具有高(gao)的(de)機械強度，用(yong)來把(ba)兩種材料(liao)永久地黏結在一(yi)起，并能在一(yi)定的(de)荷重下使它們(men)牢固(gu)地接合(he)。非(fei)結構(gou)型(xing)(xing)貼(tie)(tie)(tie)片(pian)膠(jiao)(jiao)(jiao)用(yong)來暫(zan)時固(gu)定不重的(de)物體，如把(ba)SMD黏結在PCB上，以便進(jin)行波(bo)峰焊接。密封(feng)(feng)型(xing)(xing)貼(tie)(tie)(tie)片(pian)膠(jiao)(jiao)(jiao)用(yong)來黏結兩種不受(shou)荷重的(de)物體，用(yong)于(yu)縫(feng)隙填(tian)充、密封(feng)(feng)或封(feng)(feng)裝等。前兩種貼(tie)(tie)(tie)片(pian)膠(jiao)(jiao)(jiao)在固(gu)化(hua)(hua)(hua)狀態下是(shi)(shi)硬的(de)。